Fishing – trapping – and vermin destroying
Patent
1994-10-31
1995-11-21
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
437183, 437209, 22818022, 257738, H01L 21283, H01L 2158, H01L 2160, H01L 2166
Patent
active
054686555
ABSTRACT:
A nodular metal paste (42) is used to temporarily attach the bumps (34) on a semiconductor die (32) to a substrate (38). The spherical nodules (44) composing the metal paste are dispensed onto contact pads (40) on the substrate, and then heated until they partially melt. The partial liquid region permits bonding of the individual metal nodules to the contact pads and to adjacent nodules. Subsequently, a bumped die is placed over the nodules and heated to a minimum temperature required to partially remelt to form a local tack joint. Because the metallurgical contact area between the paste nodules and the bumps is minimized, electrical contact can be sustained with a small cross-sectional area of connected material to create an electrically sound but physically weak link between die and the substrate. Once connected to the substrate, the die may be tested and burned-in, and removed afterwards with little damage to the bumps.
REFERENCES:
patent: 5108027 (1992-04-01), Warner et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5208186 (1993-05-01), Mathew
patent: 5269453 (1993-12-01), Melton et al.
Chaudhuri Olik
Clark Minh-Hien N.
Graybill David E.
Motorola Inc.
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