Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
Patent
1995-08-25
1997-01-28
Bradley, P. Austin
Metal fusion bonding
Process
With pretreating other than heating or cooling of work part...
228254, 228256, B23K 120, B23K 100
Patent
active
055971105
ABSTRACT:
The present invention provides a method for forming a solder bump (24) on a substrate (20). The substrate (20) includes a bond pad (18) having a faying surface (19) composed of solder-wettable metal. The method includes coating the faying surface (19) with a plate (16) formed of a first metal having a first melting temperature, and projecting a discrete microdroplet (14) onto the plate (16). The microdroplet (14) is formed of a molten second metal and has a second melting temperature greater than the first melting temperature. The microdroplet (14) fuses to the plate (16) to form the solder bump (24).
REFERENCES:
patent: 2512743 (1950-06-01), Hansell
patent: 3461462 (1969-08-01), Ruggiero
patent: 4828886 (1989-05-01), Hieber
patent: 5269453 (1993-12-01), Melton et al.
patent: 5477419 (1995-12-01), Goodman et al.
"Micro Dynamic Solder Pump: Drop On Demand Eutectic SnPb Solder Dispensing Device", IBM Personal Computer Company, by Tom Schiesser, Ed Menard, Ted Smith, and Jim Akin. (Date not known).
Journal of Electronic Packaging, vol. 111, "Automated Electronic Circuit Manufacturing Using Ink-Jet Technology", D. B. Wallace (Jun., 1989).
"Society of Manufacturing Engineers, Technical Paper AD87-539, :Application of Ink Jet Technology to Adhesive Dispensing", David B. Wallace and Donald J. Hayes (1987).
ISHM '89 Proceedings, "Application of Ink Jet Technology to Microelectronic Packaging", Donald J. Hayes and David B. Wallace (1989).
Melton Cynthia M.
Pfahl Robert
Bradley P. Austin
Fekete Douglas D.
Knapp Jeffrey T.
Motorola Inc.
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