Method for forming a solder bump

Details Method for forming a solder bump Method for forming a solder bump

1996-04-19

1998-04-14

Heinrich, Samuel M.

Metal fusion bonding

Process

Preplacing solid filler

228254, H01L 2160, H05K 334

Patent

active

057382697

ABSTRACT:
The solder bump apparatus includes a substantially conductive region (14) and a slot (16) projecting from the substantially conductive region (14). A solder resist region (12) at least in part surrounds a perimeter of the substantially conductive region (14) and a perimeter of the slot (16). A solder bump (22) is formed on the conductive region (14) and at least a portion of the solder resist region (12).

REFERENCES:
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patent: 5024372 (1991-06-01), Altmann et al.
patent: 5043796 (1991-08-01), Lester
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5261593 (1993-11-01), Casson et al.
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patent: 5400950 (1995-03-01), Myers et al.
patent: 5477086 (1995-12-01), Rostoker et al.
patent: 5558271 (1996-09-01), Rostoker et al.
patent: 5598967 (1997-02-01), Greenwood et al.

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