Method for forming a semiconductor chip carrier

Details Method for forming a semiconductor chip carrier Method for forming a semiconductor chip carrier

1994-04-22

1995-03-28

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437206, 437214, 437217, 437220, H01L 2160

Patent

active

054016894

ABSTRACT:
A carrier allows a semiconductor die to be flip-chip mounted to a printed wiring board. Many carriers are formed together in an array. A bottom pad constellation formed on one side of a carrier is compatible with the printed wiring board's layout rules. This pad constellation couples to a top pad constellation on the opposing side of the carrier through stepped vias. Conductive bumps made from an alloy of gold and a metal from the platinum family are formed on bond-pads of the die. The top pad constellation of the carrier is formed primarily from gold. The carrier's bottom pad constellation is formed from the gold/platinum alloy. Carriers and dice may be tested by probing the carrier's pad bottom constellation. After testing, solder bumps are formed on the bottom pad constellation, and the carrier is soldered to the printed wiring board.

REFERENCES:
patent: 4202007 (1980-05-01), Dougherty et al.
patent: 4245273 (1981-01-01), Feinberg et al.
patent: 4254445 (1981-03-01), Ho
patent: 4521449 (1985-06-01), Arnold et al.
patent: 4551788 (1985-11-01), Daniel et al.
patent: 4598167 (1986-07-01), Ushifusa et al.
patent: 4729061 (1988-03-01), Brown
patent: 4858819 (1989-08-01), Hill et al.
patent: 4874721 (1989-10-01), Kimura et al.
patent: 4914259 (1990-04-01), Kobayashi et al.
patent: 5091825 (1992-02-01), Hill et al.
patent: 5120678 (1992-06-01), Moore et al.
patent: 5122929 (1992-06-01), Palanisamy et al.
patent: 5177670 (1993-01-01), Shinohara et al.
patent: 5212115 (1993-05-01), Cho et al.
patent: 5219794 (1993-06-01), Satoh et al.
patent: 5227338 (1993-07-01), Kryzaniwsky
patent: 5239448 (1993-08-01), Perkins
patent: 5252519 (1993-10-01), Nakatani et al.
patent: 5270261 (1993-12-01), Bertin et al.
patent: 5324687 (1994-06-01), Wosnarowski

Affiliated with

Also associated with

Rating

Method for forming a semiconductor chip carrier does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming a semiconductor chip carrier, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a semiconductor chip carrier will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2250269