Method for forming a protective layer for use in packaging a...

Details Method for forming a protective layer for use in packaging a... Method for forming a protective layer for use in packaging a...

2005-04-19

2005-04-19

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S680000, C257S100000, C257S433000

Reexamination Certificate

active

06881606

ABSTRACT:
The present invention provides a semiconductor device having a protective layer for use in packaging the semiconductor device. The apparatus includes a dielectric layer, a first passivation layer formed above the dielectric layer, and a protective layer formed above the first passivation layer, the protective layer adapted to reduce stress defect failures in the semiconductor device when packaged.

REFERENCES:
patent: 5026667 (1991-06-01), Roberts, Jr.
patent: 6124179 (2000-09-01), Adamic, Jr.
patent: 20030104693 (2003-06-01), Siegel et al.

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