Metal treatment – Process of modifying or maintaining internal physical... – Processes of coating utilizing a reactive composition which...
Patent
1995-08-29
1996-10-01
Silverberg, Sam
Metal treatment
Process of modifying or maintaining internal physical...
Processes of coating utilizing a reactive composition which...
C23C 2206
Patent
active
055607853
ABSTRACT:
A water-based surface treatment agent is used to provide a chemical layer on a copper or copper alloy printing wiring board (PWB). The chemical layer shows excellent heat-resistance and moisture-resistance. The treated PWB maintains excellent solderability for extended lengths of time. The water-based surface treatment agent contains as an active ingredient 2,4-diphenylimidazole, 2,4-diphenyl-5-methylimidazole or 2-phenyl-4-benzyl-5-methylimidazole. The treating compositions with a lower carboxylic acid of up to 4 carbon atoms are soluble in water, and have improved solder wetting properties and improved solder paste spreading property. A copper compound may be included in the aqueous solution to increase the rate at which the chemical layer is formed.
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Hirao Hirohiko
Kikukawa Yoshimasa
Murai Takayuki
Nakayama Rie
Okamoto Toshihiro
Shikoku Chemicals Corporation
Silverberg Sam
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