Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
Reexamination Certificate
2006-03-28
2006-03-28
Thomas, Eric W. (Department: 2831)
Electricity: electrical systems and devices
Electrostatic capacitors
Fixed capacitor
C361S330000, C361S303000, C361S763000
Reexamination Certificate
active
07019959
ABSTRACT:
Upper, inner and lower sections (182, 180and184) of a PCB (100) are formed with each section having a substrate (140, 150and160) having patterned layers of metallization (105and110, 115and120, and125and130), respectively. Some of the patterned layers of metallization (110, 115, 120, and125) have thicker portions (171, 173) and part (188) of portion (186), and thinner portions (172, 174, 187, 190, 191, 192and193). The resultant thinner portion (175and194) in the prepreg layers (145and155) with the respective thicker portions of metallization provide decoupling capacitors, while the resultant thicker portions (196and198), for example, provide a lower capacitance for improved trace impedance for the signal traces (191and192).
REFERENCES:
patent: 3593107 (1971-07-01), Chilton et al.
patent: 4413252 (1983-11-01), Tyler et al.
patent: 4424552 (1984-01-01), Saint Marcoux
patent: 5155655 (1992-10-01), Howard et al.
patent: 6739027 (2004-05-01), Lauffer et al.
patent: 2002/0113287 (2002-08-01), Lee et al.
patent: 2000-58765 (2000-02-01), None
Gul Technologies Singapore Ltd
Lawrence Y. D. Ho & Associates
Thomas Eric W.
LandOfFree
Method for forming a printed circuit board and a printed... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for forming a printed circuit board and a printed..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a printed circuit board and a printed... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3596239