Method for forming a planarized thin film

Details Method for forming a planarized thin film Method for forming a planarized thin film

1987-07-20

1989-03-28

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

20419215, 20419235, C23C 1434

Patent

active

048161268

ABSTRACT:
Charged particles are irradiated over a thin film formed on a convex and concave surface of a substrate or over a thin film being formed on a convex and concave surface of a substrate. During the irradiation, raise in temperature of the thin film and impingement of charged particles cause the fluidization of the thin film, so that a planarized thin film is formed within a short period of time.

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H. P. Bader et al., "Planarization . . . Simulation", J. Vac. Sci. Technol., Nov./Dec. 1987, pp. 2167-2171.
Ting et al., "Study . . . SiO.sub.2 ", J. Vac. Sci. Technol. vol. 15, No. 3, May/Jun. 1978, pp. 1105-1112.
"Y. H. Park et al., Influence of D.C. Bias on Aluminum Films Prepared with a High Rate Magnetron Sputtering Cathode Thin Solid Films 129" (1985), 309-314.
J. Electrochem. Soc. Solid-State Science and Technology, Jun. 1985,--pp. 1466-1472.

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