Method for forming a photoresist pattern and apparatus applicabl

Photocopying – Projection printing and copying cameras – Step and repeat

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355 77, G03B 2742

Patent

active

051112400

ABSTRACT:
A method in which pattern elements with predetermined wall profiles and/or lateral shapes, differing from the shapes of the respective pattern elements in an irradiation mask which is used, are formed in a photoresist layer. The method comprises a modification of a conventional photolithographic process, where a substrate supporting the photoresist layer is shifted laterally relative to the mask or the mask image in a continuous mode or in steps during exposure. Also disclosed is an apparatus which shifts a substrate relative to a mask in the x- and/or the y-direction or shifts the path of the beam relative to the substrate, controlling the shifting in a predetermined manner. The method--especially in connection with the apparatus--allows formation of reproducible photoresist patterns with a great variety of differently formed wall profiles and/or lateral shapes. Using the method, photoresist patterns can be flexibly adapted to many applications.

REFERENCES:
patent: 4224361 (1980-09-01), Romankiv
patent: 4298273 (1981-11-01), Nishizuka et al.
patent: 4308337 (1981-12-01), Roach et al.
patent: 4545673 (1985-10-01), Bergsma
patent: 4708466 (1987-11-01), Isohata et al.
patent: 4716443 (1987-12-01), Byers
patent: 4748477 (1988-05-01), Isohata et al.
Abolafia, O. R., "Tapered Vias in a Photosensitive Dielectric Film", IBM Tech. Discl. Bull., vol. 21, No. 12 (May 1979), p. 4787.
Speidell, J. L., "Trench Elimination From Ion Etching", IBM Tech. Discl. Bull., vol. 23, No. 2 (Jul. 1980), pp. 826-827.
Quickle, R. J., "Spot Overlap in a Variably Shaped Spot Electron-Beam Exposure Tool", IBM Tech. Discl. Bull., vol. 24, No. 1A (Jun. 1981) pp. 79-81.
Ismail, K., "A Novel Method for Submicron Structurization Using Optical Projection Lithography", Microelectronic Engineering, vol. 1 (1983), pp. 295-230.
Badami, D. A., et al, "Photoresist Slope Control By Adjusting the Bandwidth and Wavelength of the Exposure Light", IBM Tech. Discl. Bull., vol. 26, No. 4 (Sep. 1983), pp. 1935-1936.
"Submikron-Lithografie fur V.L.S.I.", Neus Aus Der Technik, No. 2, No. 774 (Apr. 1984).
"A Process for Obtaining Positive Resist Slopes", Research Disclosure, No. 267, Abstract No. 26730, Emsworth, Hampshire, Great Britain (Jul. 1986), p. 399.

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