Method for forming a patterned oxide superconductor thin film

Details Method for forming a patterned oxide superconductor thin film Method for forming a patterned oxide superconductor thin film

1994-02-15

1995-08-29

King, Roy V.

Superconductor technology: apparatus, material, process

Processes of producing or treating high temperature...

Producing josephson junction, per se

505410, 505413, 505473, 505192, 505728, 505702, 427 62, 427 63, 257 33, 216 3, H01L 3924

Patent

active

054460166

ABSTRACT:
A method for forming a patterned oxide superconductor thin film on a substrate comprises steps of forming a metal or semi-metal layer on a portion of the substrate, on which the oxide superconductor thin film will be formed, forming a layer of a material including silicon on a portion of the substrate, on which an insulating layer will be formed, removing the metal or semi-metal layer and depositing an oxide superconductor thin film over the substrate.

REFERENCES:
patent: 5196395 (1993-03-01), James et al.
patent: 5198413 (1993-03-01), Tarutani et al.
Ma et al, "Novel method of patterning YBaCuO Superconducting thin films", Appl. Phys. lett. 55(9) Aug. 1989, pp. 896-898.
Copetti et al, "Improved inhibit patterning of Y.sub.1 Ba.sub.2 Cu.sub.3 O.sub.7 thin films", Appl. Phys. lett 61(25) Dec. 1992, pp. 3041-3043.
Yamada et al, "Ultrathin metal films on silicon substrates for the growth of oxide superconductor overlayers", Proc. Int. Conf. Electron. Mater. 2nd, Edited by Chang et al. (1990), pp. 387-392.

Affiliated with

Also associated with

Rating

Method for forming a patterned oxide superconductor thin film does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming a patterned oxide superconductor thin film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a patterned oxide superconductor thin film will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1819484