Method for forming a patterned metallic layer in a thin film mag

Details Method for forming a patterned metallic layer in a thin film mag Method for forming a patterned metallic layer in a thin film mag

1996-07-24

1998-12-08

Gupta, Yogendra N.

Etching a substrate: processes

Forming or treating article containing magnetically...

216 63, 216 67, 216 75, 204474, 427473, B44C 122

Patent

active

058464417

ABSTRACT:
A method for forming a patterned metallic layer on a substrate is employed to form a first layer on top surface of the substrate. A patterned mask layer is then deposited on top of the first layer, thereby exposing selected portions of the first layer. Thereafter, a second and a third layers are successively formed on top of the selected portions of the first layer, and the patterned mask layer is removed. Subsequently, the first layer is removed except the portions thereof intervening between the top surface of the substrate and the second layer by using a dry etching method to thereby form the patterned metallic layer including the second layer and the exposed portions of the first layer.

REFERENCES:
patent: 4462881 (1984-07-01), Yamamoto et al.
patent: 5281300 (1994-01-01), Amemori
patent: 5544774 (1996-08-01), Gray

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