Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2010-01-14
2011-12-20
Ahmadi, Mohsen (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S015000, C438S064000, C438S113000, C438S124000, C438S025000, C257SE21502, C257SE21503, C257SE21499
Reexamination Certificate
active
08080444
ABSTRACT:
A method of placing a die includes providing an embedded plane. The embedded plane has a openings, grid lines, and protruding portions. Each of the plurality of openings are surrounding by a subset of the plurality of grid lines. At least one of the protruding portions extends into one of the openings. A die is placed into one of the openings and at least one of the protruding portions bends during such placement so that it is in contact with at least a portion of a minor surface of the die.
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U.S. Appl. No. 12/419,708, filed Apr. 7, 2009.
Ahmadi Mohsen
Chiu Joanna G.
Freescale Semiconductor Inc.
Vo Kim Marie
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