Method for forming a package of adhesive material in a non-tacky

Plastic and nonmetallic article shaping or treating: processes – With printing or coating of workpiece – Coating or impregnating workpiece before molding or shaping...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

53410, 53423, 264255, 264267, B29C 7000, B29C 3910

Patent

active

057258201

ABSTRACT:
A process for forming a package of hot melt adhesive material includes forming a bottom layer of molten non-tacky polymeric material in a container and depositing a bead of molten non-tacky polymeric material along the top edges of an open-faced rigid container and allowing the bead of polymeric material to pour down the walls of the rigid container by gravity so as to coat the inside wall surfaces and bottom surface of the container with a substantially uniform layer of the non-tacky polymeric material. The layer of non-tacky polymeric material is allowed to solidify in the container and form a substantially rigid mold of the polymeric material within the container. The mold is located in a rigid support structure and is conveyed to a molten adhesive filling station. The mold is filled at the filling station with a metered amount of molten adhesive which is allowed to cool and solidify within the mold thereby forming a solidified package of hot melt adhesive material.

REFERENCES:
patent: 2287849 (1942-06-01), Wilson
patent: 2496609 (1950-02-01), Antwerpen
patent: 2791326 (1957-05-01), Sparks et al.
patent: 2931148 (1960-04-01), Smith
patent: 3837778 (1974-09-01), Parker
patent: 3851438 (1974-12-01), Brisman
patent: 4088727 (1978-05-01), Elliott
patent: 4112158 (1978-09-01), Creekmore et al.
patent: 4135033 (1979-01-01), Lawton
patent: 4247502 (1981-01-01), Loechell
patent: 4306657 (1981-12-01), Levy
patent: 4318475 (1982-03-01), Robinson
patent: 4334615 (1982-06-01), Butler et al.
patent: 4450962 (1984-05-01), Matthews et al.
patent: 4514446 (1985-04-01), Kadono et al.
patent: 4755245 (1988-07-01), Viel
patent: 5110641 (1992-05-01), Kean
patent: 5112552 (1992-05-01), Wittmann et al.
patent: 5257491 (1993-11-01), Rouyer et al.
patent: 5292468 (1994-03-01), Colombani
patent: 5373682 (1994-12-01), Hatfield et al.
patent: 5401455 (1995-03-01), Hatfield et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming a package of adhesive material in a non-tacky does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming a package of adhesive material in a non-tacky, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a package of adhesive material in a non-tacky will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-136855

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.