Method for forming a multilayered metal network for bonding comp

Details Method for forming a multilayered metal network for bonding comp Method for forming a multilayered metal network for bonding comp

1989-03-14

1990-03-06

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437189, 437194, 437195, 437231, 156643, 427 51, 427 96, H01L 2100, H01L 2102, B44C 122, C03C 1500

Patent

active

049065920

ABSTRACT:
In a high-density integrated circuit having a multilayered metal interconnection network, a planarization layer is formed over a lower metal layer which includes conductors having steep edges by chemically depositing a dielectric layer in the vapor phase over the lower metal layer so as to fill up hollows formed in the dielectric layer in intervals between the conductors, spreading a viscous layer of spin-on-glass over the dielectric layer, annealing the spin-on-glass layer to form a compact mass, forming vias through the spin-on-glass and dielectric layers to the conductors, and applying an upper metal layer over the spin-on-glass layer so as to fill the vias and provide electrical contacts to the conductors of the lower metal layer.

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