Method for forming a multilayer microelectronic wiring module

Details Method for forming a multilayer microelectronic wiring module Method for forming a multilayer microelectronic wiring module

1992-04-03

1993-11-09

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 156245, 1563096, H05K 336, H01K 310, B29C 4700, B32B 3120

Patent

active

052591107

ABSTRACT:
A multilayer microelectronics module formed by laminating together individual thermoplastic polymer sheets formed by injection, compression or other suitable molding techniques. Metal pieces to form vias of a desired shape and size are inserted into the molded sheets, preferably by in situ insert molding. The vias provide an electrical connection from the top to the bottom surfaces of the sheets.

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