Method for forming a monolithic electronic module by stacking pl

Details Method for forming a monolithic electronic module by stacking pl Method for forming a monolithic electronic module by stacking pl

1995-08-16

1998-07-28

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438113, 438461, H01L 2160, H01L 2166, H01L 2170

Patent

active

057862370

ABSTRACT:
A fabrication method for manufacturing a monolithic electronic module comprising a plurality of stacked planar extending arrays of integrated circuit chips. The fabrication method includes dicing a wafer of integrated circuit chips into a plurality of arrays of integrated circuit chips. The arrays of integrated circuit chips are then stacked to form an electronic module. A metallization pattern may be deposited on a substantially planar surface of the electronic module, and used to interconnect the various arrays of integrated circuit chips contained therein. Specific details of the fabrication method and resultant multi-chip package are set forth.

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