Plastic and nonmetallic article shaping or treating: processes – Disparate treatment of article subsequent to working,...
Patent
1988-10-28
1990-07-31
Silbaugh, Jan H.
Plastic and nonmetallic article shaping or treating: processes
Disparate treatment of article subsequent to working,...
264511, 264132, 264135, 264233, 264255, 264265, 264266, 26427215, 26427217, 264278, 29620, 29848, 156656, 156150, 156902, B29C 4514
Patent
active
049449087
ABSTRACT:
A printed circuit is formed by conventional methods over an adhesive coating applied to a flexible high temperature withstandability disposable backing to form a flexible laminate which is positioned in a cavity of an injection mold to conform to surface variations. The printed circuit conductors are surrounded on three sides by molten plastic material injected into the mold cavity to embed the conductors in the respective surfaces of the molded plastic article, which surfaces are non-coplanar and adjoining and the conductors are continuous from one surface to the other. The bond strength of the adhesive is preferably high with regard to the backing and low with regard to the printed circuit conductors to permit adhesive and backing to be peeled away after molding, thereby providing a three diemensional printed circuit in, for example, a recessed area of a molded plastic housing part of electrical apparatus.
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"In-Mold Decal Process Adapted to Molded Circuit Boards", Technology Newsfocus, Plastics Technology, Dec. 1988, p. 13.
Czarnecki Neil A.
Leveque Denis J.
Eaton Corporation
Fiorilla Christopher A.
Silbaugh Jan H.
Vande Zande L. G.
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