Method for forming a mold-release coating

Coating processes – Direct application of electrical – magnetic – wave – or... – Electrostatic charge – field – or force utilized

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427476, 427485, 427133, 427135, B05D 104

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active

061174955

ABSTRACT:
The method for forming a mold-release coating on a mold surface includes two basic steps: (a) providing a base coat of material on the mold surface and (b) electrostatically depositing a release powder onto the base coat of material. The base coat of material has a surface which is capable of accepting and retaining the release powder. Upon deposition of the release powder, the release powder embeds the base coat of material thereby forming a mold-release coating. The base coat may be a wax or a solvent base wax.

REFERENCES:
patent: 2795512 (1957-06-01), Sherratt et al.
patent: 3101244 (1963-08-01), Hood et al.
patent: 3127457 (1964-03-01), Di Pinto
patent: 3279936 (1966-10-01), Forestek
patent: 3341646 (1967-09-01), Britain
patent: 3492394 (1970-01-01), Heine
patent: 3598626 (1971-08-01), Probst et al.
patent: 3624190 (1971-11-01), Cekada, Jr.
patent: 3671007 (1972-06-01), Bailey et al.
patent: 3883628 (1975-05-01), Martin
patent: 3925530 (1975-12-01), Rees
patent: 3928673 (1975-12-01), Pardee et al.
patent: 3931381 (1976-01-01), Lindberg
patent: 3995979 (1976-12-01), Fedrigo
patent: 4110119 (1978-08-01), Boehmke et al.
patent: 4118235 (1978-10-01), Horiuchi et al.
patent: 4131662 (1978-12-01), Cekoric et al.
patent: 4281032 (1981-07-01), Escott et al.
patent: 4308063 (1981-12-01), Horiuchi et al.
patent: 4312672 (1982-01-01), Blahak et al.
patent: 4427803 (1984-01-01), Fukui et al.
patent: 4681712 (1987-07-01), Sakakibara et al.
patent: 4892585 (1990-01-01), Fischer et al.
patent: 5021109 (1991-06-01), Petropoulos et al.
patent: 5028366 (1991-07-01), Harakal et al.
patent: 5035849 (1991-07-01), Uemura et al.
patent: 5039435 (1991-08-01), Hanano
patent: 5212245 (1993-05-01), Franks et al.
"Hawley's Condensed Chemical Dictionary" Richard J. Lewis, Sr. 13.sup.th Edition, pp. 897-898 1997.

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