Method for forming a microelectromechanical fluid ejection...

Details Method for forming a microelectromechanical fluid ejection... Method for forming a microelectromechanical fluid ejection...

2007-05-22

2007-05-22

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Fluid pattern dispersing device making, e.g., ink jet

C029S025350, C029S830000, C029S831000, C029S832000, C216S027000, C347S054000

Reexamination Certificate

active

11026032

ABSTRACT:
A microelectromechanical fluid ejection device is formed upon a wafer upon which an interconnect layer is disposed. The fluid ejection device includes a number of fluid passageways that are produced by firstly forming a bore through the interconnect layer, from the interconnect layer side, to a depth that is greater than the interface. A second bore is back-etched through the underside of the wafer. The first and second bores meet to form the fluid passageway. Fabricating the ejection device in accordance with the disclosed method avoids etchant traveling along the interface and potentially damaging CMOS circuits located at the interface.

REFERENCES:
patent: 4599628 (1986-07-01), Doring et al.
patent: 4883219 (1989-11-01), Anderson et al.
patent: 4937597 (1990-06-01), Yasuhara et al.
patent: 5245244 (1993-09-01), Takahashi et al.
patent: 5726693 (1998-03-01), Sharma et al.
patent: 6243113 (2001-06-01), Silverbrook
patent: 6364453 (2002-04-01), Silverbrook
patent: 6536874 (2003-03-01), Silverbrook
patent: 6666544 (2003-12-01), Silverbrook
patent: 6991317 (2006-01-01), Silverbrook
patent: WO 00/23279 (2000-04-01), None

Affiliated with

Also associated with

Rating

Method for forming a microelectromechanical fluid ejection... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming a microelectromechanical fluid ejection..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a microelectromechanical fluid ejection... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3817068