Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-04-12
1997-12-23
Hall, Carl E.
Metal working
Method of mechanical manufacture
Electrical device making
360123, 360126, G11B 542
Patent
active
056996055
ABSTRACT:
A thin film magnetic head is carried in a recessed region which is etched in a basecoat. The thin film magnetic head includes upper and lower pole pieces having an upper pole tip and a lower pole tip, respectively. The upper and lower pole tips form a magnetic flux gap. Electrical conductors are carried in an insulating layer between the upper and lower pole pieces. The magnetic flux gap defines a plane which is generally parallel with a plane defined by the conductors. The electrical conductors lie on either side of the plane.
REFERENCES:
patent: 4281357 (1981-07-01), Lee
patent: 4517616 (1985-05-01), Bischoff
patent: 4684438 (1987-08-01), Lazzari
patent: 4819111 (1989-04-01), Keel et al.
patent: 4838992 (1989-06-01), Abraham
patent: 4853815 (1989-08-01), Diepers
patent: 4872079 (1989-10-01), Roberts
patent: 4878290 (1989-11-01), Masud et al.
patent: 4896417 (1990-01-01), Sawada et al.
patent: 4919748 (1990-04-01), Bredbenner et al.
patent: 4944831 (1990-07-01), Sibuet
patent: 4944836 (1990-07-01), Beyer et al.
patent: 4949207 (1990-08-01), Lazzari
patent: 4970615 (1990-11-01), Gau
patent: 4992901 (1991-02-01), Keel et al.
patent: 5084957 (1992-02-01), Amin et al.
Cross Section of IBM Head of Jan. 20, 1989.
Two Cross Sections of Yamaha Head of Sep. 1989.
Cross section of AMC Head of Sep. 18, 1990.
Amin Nurul
Bortins John
Yan Ying
Hall Carl E.
Seagate Technology Inc.
LandOfFree
Method for forming a magnetic thin film head with recessed basec does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for forming a magnetic thin film head with recessed basec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a magnetic thin film head with recessed basec will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1794008