Method for forming a magnet pattern on magnetic memory circuit c

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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29432, 29604, 29609, 29625, 83 51, 156252, 156261, 156265, 156293, 156298, 156581, 174 685, 428900, 428901, B32B 3120, B32B 3112, B41M 308, H05K 100

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039322530

ABSTRACT:
A sheet of magnetic material is placed over a surface of a malleable carrier and stuck with a multi-projectioned punch. Each projection of the punch removes a wafer of the magnetic material from the sheet of magnetic material, and embeds the wafer into the carrier to form a pattern of magnetic material wafers in the surface of the carrier. The carrier is then positioned, wafer bearing side down, over an adhesive coated surface of a substrate, and a surface of the carrier, opposite from the wafer bearing surface, is struck with a multiprojectioned punch to force with each projection an individual one of the wafers out of the surface of the carrier and into the adhesive on the substrate. The malleable carrier is then peeled from the adhesive coated surface of the substrate and from the wafers secured thereto, to leave on the surface of the substrate the pattern of magnetic material wafers.

REFERENCES:
patent: 2033553 (1936-03-01), Scholl
patent: 2367490 (1945-01-01), Ducklo
patent: 2969300 (1961-01-01), Franz
patent: 3301730 (1967-01-01), Spiwak et al.
patent: 3547724 (1970-12-01), Zagusta
patent: 3554832 (1971-01-01), Fischer, Jr.
patent: 3678577 (1972-07-01), Weglin et al.
patent: 3809597 (1974-05-01), Connett
patent: 3847700 (1974-11-01), Dalal

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