Method for forming a lead during molding of an electronic housin

Details Method for forming a lead during molding of an electronic housin Method for forming a lead during molding of an electronic housin

1993-08-27

1995-09-12

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29882, 29883, 295274, 425112, H01R 4300, H01R 4304

Patent

active

054488249

ABSTRACT:
A molding apparatus and a molding method are provided which enable leads which project from an electronic housing, such as a housing configured to receive an accelerometer, to be formed during the molding operation in which the housing is formed. As a result, the leads used in the molding operation can be in an as-stamped, unformed condition, so as to facilitate handling and loading of the leads into the molding apparatus. In addition, because forming occurs during the molding operation, subsequent secondary forming operations are not required to achieve the desired configuration for the leads.

REFERENCES:
patent: 4135297 (1979-01-01), Guttenberger et al.
patent: 4965933 (1990-10-01), Mraz et al.
patent: 5038468 (1991-08-01), Wanatowicz
Hastede, R. G. and Lozier, G. A. "Core Plane Terminal Forming Die," IBM Tech. Disclosure Bull., vol. 8, No. 9, Feb. 1966, p. 1208.

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