Method for forming a hole and method for forming nozzle in orifi

Details Method for forming a hole and method for forming nozzle in orifi Method for forming a hole and method for forming nozzle in orifi

1996-03-26

1998-09-22

Breneman, R. Bruce

Etching a substrate: processes

Forming or treating thermal ink jet article

21912171, 347 47, 298901, B41J 216

Patent

active

058110194

ABSTRACT:
A method for a hole inclined relative to the direction of thickness of a workpiece by light energy. A groove is formed in an energy-concentrated portion of a plate as a workpiece for opening on a major surface of a plate operating as a light energy irradiated surface for forming an irregular surface portion. The light energy is illuminated on this irregular surface portion from the major surface of the plate in an oblique direction relative to the direction of thickness of the plate. The irregular surface portion of the workpiece is formed integrally with the workpiece by injection molding. The irregular surface portion may also be formed by sand-blasting, chemical etching or by an abrasive brush. The light energy is a laser, especially an excimer laser. The workpiece may be formed of an inorganic material, an organic material or a metallic material. The hole of a larger angle of inclination is formed by employing the light energy.

REFERENCES:
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4959119 (1990-09-01), Lantzer
patent: 5305015 (1994-04-01), Schantz et al.
patent: 5305018 (1994-04-01), Schantz et al.
patent: 5312517 (1994-05-01), Ouki

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