Method for forming a hole and method for forming nozzle in orifi

Details Method for forming a hole and method for forming nozzle in orifi Method for forming a hole and method for forming nozzle in orifi

1998-01-12

2000-07-04

Gulakowski, Randy

Etching a substrate: processes

Forming or treating thermal ink jet article

216 56, 216 65, 347 47, 21912171, G01D 1518

Patent

active

060834110

ABSTRACT:
A method of forming adjacent ink and dilution solution nozzles in an orifice plate includes first providing an orifice plate having a thickness dimension. A first nozzle is then formed having a first orifice extending through the orifice plate at a first angular orientation that is generally normal to the thickness dimension. A second nozzle is then formed having a second orifice adjacent to the first orifice and at a second different angular orientation. One of the first and second nozzles is the ink nozzle and the other of the first and second nozzles is the dilution solution nozzle. The first and second nozzles are formed by laser light irradiation.

REFERENCES:
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4959119 (1990-09-01), Lantzer
patent: 5208604 (1993-05-01), Watanabe et al.
patent: 5305015 (1994-04-01), Schantz et al.
patent: 5305018 (1994-04-01), Schantz et al.
patent: 5312517 (1994-05-01), Ouki

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