Method for forming a hermetically sealed cavity

Details Method for forming a hermetically sealed cavity Method for forming a hermetically sealed cavity

2007-03-28

2011-11-22

Van, Luan (Department: 1724)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

Reexamination Certificate

active

08062497

ABSTRACT:
One inventive aspect relates to a method for forming hermetically sealed cavities, e.g. semiconductor cavities comprising fragile devices, MEMS or NEMS devices. The method allows forming hermetically sealed cavities at a controlled atmosphere and pressure and at low temperatures, for example, at temperatures not exceeding about 200° C. The method further allows forming sealed cavities with short release times, for example, release times of about a few minutes to 30 minutes. The method may, for example, be used for zero level packaging of MEMS or NEMS devices.

REFERENCES:
patent: 6184582 (2001-02-01), Coult et al.
patent: 7029829 (2006-04-01), Stark et al.
patent: 7160429 (2007-01-01), Cohen et al.
patent: 2002/0086520 (2002-07-01), Chiang
patent: 1433741 (2004-06-01), None
patent: WO 2005-089348 (2005-09-01), None

Affiliated with

Also associated with

Rating

Method for forming a hermetically sealed cavity does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming a hermetically sealed cavity, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a hermetically sealed cavity will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4305760