Method for forming a heat dissipation apparatus

Metal working – Method of mechanical manufacture – Heat exchanger or boiler making

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164 98, 174 163, 165 803, B23P 1526

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active

055332579

ABSTRACT:
A heat dissipation apparatus having a base structure (11) and fins (29, 43) and a method for making the heat dissipation apparatus. The base structure (11) is formed as a molded porous preform structure having a top surface (12), a bottom surface (13), and grooves (14) in the bottom surface (13). A layer of dielectric material (17) is placed on the top surface (12) and the porous base structure is infiltrated with a conductive material, thereby bonding the layer of dielectric material (17) to the base structure (11). The grooves (14) are coated with a conductive epoxy and the fins (29) are inserted into the grooves (14) to form a heat dissipation apparatus (30). Alternatively, the fins (43) are formed when the porous base structure is infiltrated with the conductive material, thereby forming a unitary heat dissipation apparatus (44).

REFERENCES:
patent: 4491557 (1985-01-01), Breitmoser et al.
patent: 4777998 (1988-10-01), Charbonnier
patent: 4879891 (1989-11-01), Hinshaw
patent: 4920864 (1990-05-01), Skingle et al.
patent: 4960736 (1990-10-01), Luxzcz et al.
patent: 5007475 (1991-04-01), Kennedy et al.
patent: 5014776 (1991-05-01), Hess
patent: 5222298 (1993-06-01), Schatz
patent: 5247734 (1993-09-01), Lubbe et al.
patent: 5259436 (1993-11-01), Yun et al.
patent: 5289337 (1994-02-01), Aghazadeh et al.
patent: 5297001 (1994-03-01), Sterling
patent: 5299090 (1994-03-01), Brady et al.
patent: 5300735 (1994-04-01), Yokono et al.
patent: 5321888 (1994-06-01), Nemes
patent: 5428897 (1995-07-01), Jordan et al.

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