Method for forming a film of dielectric material on an electric

Details Method for forming a film of dielectric material on an electric Method for forming a film of dielectric material on an electric

1986-03-11

1987-03-31

Bueker, Richard

Coating processes

Measuring, testing, or indicating

Thickness or uniformity of thickness determined

427 541, 427 82, 427 96, 427337, 4273855, 430319, B05D 512

Patent

active

046542230

ABSTRACT:
Thin dielectric films are formed on an electronic component by in situ curing a polymerizable oligomer which is end capped with vinyl and/or acetylenic end groups. The polymerizable oligomers are comprised of polyamic acids, polyamic esters, polyisoimides, and mixtures thereof which can be crosslinked to form a three-dimensional network via sites at the vinyl or acetylenic end groups and sites at carbonyl groups contained within the polymeric chain. Use of these polymerizable oligomers permits utilization of low temperature methods of curing which reduce intrinsic and extrinsic stress within the cured dielectric film.

REFERENCES:
patent: 3671490 (1972-06-01), Bargain
patent: 3879349 (1975-04-01), Bilow et al.
patent: 3985597 (1976-10-01), Zielinski
patent: 4258146 (1981-03-01), Balanson et al.
patent: 4347306 (1982-08-01), Takeda et al.
Sefelk et al "Investigation of the Structure . . ." Macromolecules, vol. 12, May/Jun. 1979, pp. 423-425.

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