Method for forming a conductor pattern using lift-off

Details Method for forming a conductor pattern using lift-off Method for forming a conductor pattern using lift-off

1985-10-11

1987-06-23

Hearn, Brian E.

Metal working

Method of mechanical manufacture

Assembling or joining

29571, 29580, 29576B, 357 15, 357 71, 357 239, 357 22, H01L 21308, H01L 2131, H01L 2132, H01L 21467

Patent

active

046741747

ABSTRACT:
Disclosed is a method for forming a conductor pattern which comprises the steps of forming a conductive layer on a semiconductor substrate, forming a photoresist film on the conductive layer, removing that portion of the photoresist film located on a conductor pattern forming region of the conductive layer, forming a first masking metal film over the whole surface of the resultant structure, removing the photoresist film along with that portion of the first masking metal film formed thereon so that a portion of the first masking film remains on the conductor pattern forming region of the conductive layer to form a first masking metal pattern, and selectively removing the conductive layer by anisotropic etching to form the conductor pattern.
Since the selective removal of the conductor layer is accomplished by the use of the metal pattern as a mask, it is possible to form a much finer conductor pattern than is obtained with the use of the photoresist pattern as the mask.

REFERENCES:
patent: 4448800 (1984-05-01), Ehara et al.
patent: 4586063 (1986-04-01), Nakamura et al.
M. A. Nicolet, Thin Solid Films, vol. 52, pp. 415-443, 1978.
A. Armigliato, M. Finetti, A. Garulli, S. Guerri, R. Lotti and P. Ostoja, Thin Solid Films, vol. 129, pp. 55-61, 1985.
S. K. Ghandhi, VLSI Fabrication Principles, John Wiley & Sons, New York, New York, 1983.

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