Method for forming a conductive layer pattern

Details Method for forming a conductive layer pattern Method for forming a conductive layer pattern

2008-04-15

2008-04-15

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S830000, C174S257000, C427S098500, C427S466000

Reexamination Certificate

active

07356921

ABSTRACT:
A method for forming a conductive layer pattern by selectively depositing droplets containing conductive material onto a porous receiving layer. Much of the conductive material is left on the surface for forming wiring patterns but some of it permeates the pockets or voids in the receiving layer and can be used, for example, to provide interlayer connections in laminated wiring boards. Preferably, the conductive material is provided by fine conductive particles, organometallic compounds or mixtures thereof.

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Communication from Chinese Patent Office re: counterpart application (and translation).

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