Method for forming a circuit board via structure for high...

Details Method for forming a circuit board via structure for high... Method for forming a circuit board via structure for high...

2011-08-09

2011-08-09

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S847000, C029S849000, C029S851000, C029S853000, C174S250000, C174S255000, C174S262000, C174S266000

Reexamination Certificate

active

07992297

ABSTRACT:
One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.

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Houfei Chen et al., “Coupling of Large Numbers of Vias in Electronic Packaging Structures and Differential Signaling,” IEEE MTT-S International Microwave Symposium, Seattle, WA, Jun. 2-7, 2002.
Thomas Neu, “Designing Controlled Impedance Vias,” at 67-72, EDN (Oct. 2, 2003).
“PCB/Overview,” published at www.ul.ie/˜rinne/ee6471/ee6471%20wk11.pdf (Apr. 11, 2004).

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