Method for forming a ceramic circuit substrate

Details Method for forming a ceramic circuit substrate Method for forming a ceramic circuit substrate

1994-06-10

1996-11-19

Engel, James

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156182, 156263, 264 61, 264 63, B32B 3106, B32B 3120, B32B 3110

Patent

active

055758720

ABSTRACT:
A laminated body of a plurality of slit ceramic green sheets 10 with rod-shaped members 11 placed in the spaces defined by the slits 9 is sandwiched by two laminated ceramic green bodies of a plurality of blank ceramic green sheets 8, pressing to make the laminated ceramic green bodies integral with each other, and then after the rod-shaped members 11 are pulled out, the integrated laminated ceramic green bodies are sintered. Thus circular sectional channels 13 with reduced flow resistance for a coolant flowing therethrough are formed inside the ceramic circuit substrate 14. The channels 13 can have low flow resistance and can have high cooling efficiency.

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