Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1987-10-22
1989-06-27
Silbaugh, Jan H.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156293, 156305, 1563096, 264254, 264255, 26427215, B29C 3910, B29C 4112
Patent
active
048426857
ABSTRACT:
A method for forming a solid state semiconductor pressure sensor in which the pressure sensor element is protected from the ambient whose pressure is being measured by a combination of a pressure transfer medium and a thin covering membrane. The method includes applying the thin covering membrane so as to substantially avoid entrapment of air or formation of voids in the pressure transfer medium which would degrade the performance of the sensor. The pressure transfer medium is a gel-like material such as a silastic. The membrane is chosen to be substantially impermeable to the ambients being measured and sufficiently flexible to avoid attenuation of the input pressure signal. The membrane is cast in place by applying a thin liquid coating or a heat deformable film over the pressure transfer medium and then coverting it into a thin solid membrane stuck to the pressure transfer medium and the pressure sensor body.
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patent: 3566459 (1971-03-01), Rindner et al.
patent: 4241493 (1980-12-01), Andrulitis et al.
patent: 4274423 (1981-06-01), Mizuno et al.
patent: 4644797 (1987-02-01), Ichikawa et al.
patent: 4655088 (1987-04-01), Adams
Handy Robert M.
Motorola Inc.
Sidwell Kelley M.
Silbaugh Jan H.
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