Method for forming a carbon resistance in a printed wiring board

Details Method for forming a carbon resistance in a printed wiring board Method for forming a carbon resistance in a printed wiring board

1991-04-09

1992-09-29

Lusignan, Michael

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427122, 427113, 427270, 427271, 427353, C23C 2600

Patent

active

051513005

ABSTRACT:
The method for forming a carbon resistance in a printed wiring board is characterized in that, in a method for forming a carbon resistance in the circuit of a printed wiring board, a carbon resistance to be disposed in the circuit which is formed in a laminated film is previously deposited on and correspondingly to the surface of said circuit, and the protective film of the carbon resistance of the laminated film is removed.
In accordance with the method for forming a carbon resistance in a printed wiring board, a carbon resistance which is previously formed in a laminated film and to be disposed in the printed wiring board circuit is deposited on and correspondingly to the surface of the circuit, and simultaneously the protective film of the carbon resistance of the laminated film is removed, thereby performing the formation, and it is thus possible to form a carbon resistance which always comprises a stable resistance value, without depending on the smoothness of the circuit surface or the forming conditions of the carbon resistance.

REFERENCES:
patent: 4626961 (1986-12-01), Ono
patent: 4918814 (1990-04-01), Redmond

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