Method for forming a buried subcollector in a semiconductor subs

Details Method for forming a buried subcollector in a semiconductor subs Method for forming a buried subcollector in a semiconductor subs

1983-09-16

1986-02-04

Roy, Upendra

Metal working

Method of mechanical manufacture

Assembling or joining

148 15, 148187, 357 34, 357 91, H01L 21263, H01L 21265

Patent

active

045676453

ABSTRACT:
The method is comprised of the following steps:

REFERENCES:
patent: 3895965 (1975-07-01), MacRae et al.
patent: 3945856 (1976-03-01), Koenig et al.
patent: 4149905 (1979-04-01), Levinstein et al.
patent: 4329773 (1982-05-01), Geipel, Jr. et al.
patent: 4386968 (1983-06-01), Hinkel et al.
Briska et al., IBM-TDB, 20 (1980) 644.
Brack et al., IBM-TDB, 26 (1983) 681.
Beyer et al., IBM-TDB, 19 (1977) 3051.
Mueller et al., IBM-TDB, 19 (1976) 865.

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