Method for forming a bump on a semiconductor device

Details Method for forming a bump on a semiconductor device Method for forming a bump on a semiconductor device

1994-03-15

1995-09-12

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

2282481, 228254, 427123, H01L 2100

Patent

active

054491088

ABSTRACT:
A method for forming a bump on a semiconductor device takes advantage of the solderability difference of the solder paste applied to a solder pad in order to form a bump, so that it does not require an etching process. In addition, a pre-test of the semiconductor device can be carried out in a state that the solder pad is united with a BLM layer, so as to prove out semiconductor devices of good quality in advance of finishing the formation of the bump and the semiconductor devices of good quality can be applied with a subsequent process.

REFERENCES:
patent: 4831494 (1989-05-01), Arnold et al.
patent: 4866507 (1989-09-01), Jacobs et al.
patent: 4898320 (1990-02-01), Dunaway et al.
patent: 5217597 (1993-06-01), Moore et al.
patent: 5266522 (1993-11-01), Di Giacomo et al.
patent: 5289631 (1994-03-01), Koopman et al.

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