Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate
2005-02-28
2008-08-26
Pham, Thanh V (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
C438S106000, C438S108000, C438S114000, C257S783000, C156S060000, C156S327000
Reexamination Certificate
active
07416921
ABSTRACT:
A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip52includes a step of providing a hardening trigger that is not heat to insulating adhesive51either before the semiconductor chip52is mounted on the substrate50or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate50by pressure welding or metal combining while hardening of the insulating adhesive51is progressing due to provision of the hardening trigger.
REFERENCES:
patent: 3853578 (1974-12-01), Suzuki et al.
patent: 4536524 (1985-08-01), Hart et al.
patent: 5579573 (1996-12-01), Baker et al.
patent: 6113728 (2000-09-01), Tsukagoshi et al.
patent: 6326329 (2001-12-01), Nunan
patent: 6383596 (2002-05-01), Arioka et al.
patent: 6437450 (2002-08-01), Baba et al.
patent: 2002/0164837 (2002-11-01), Baba et al.
patent: 2004/0047127 (2004-03-01), Yamauchi et al.
patent: 5-235096 (1993-09-01), None
patent: 2001-308145 (2001-11-01), None
patent: 2002-26070 (2002-01-01), None
patent: 2002-203874 (2002-07-01), None
Kainuma Norio
Kira Hidehiko
Kobae Kenji
Matsumura Takayoshi
Nakamura Kimio
Arent & Fox LLP
Fujitsu Limited
Pham Thanh V
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