Method for flip-chip mounting utilizing a delay curing-type...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step

Reexamination Certificate

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Details

C438S106000, C438S108000, C438S114000, C257S783000, C156S060000, C156S327000

Reexamination Certificate

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07416921

ABSTRACT:
A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip52includes a step of providing a hardening trigger that is not heat to insulating adhesive51either before the semiconductor chip52is mounted on the substrate50or during bonding; and a step of bonding the bumps of the semiconductor chip to the pads of the substrate50by pressure welding or metal combining while hardening of the insulating adhesive51is progressing due to provision of the hardening trigger.

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