Etching a substrate: processes – Nongaseous phase etching of substrate – Etching inorganic substrate
Reexamination Certificate
2006-09-26
2010-11-02
Vinh, Lan (Department: 1713)
Etching a substrate: processes
Nongaseous phase etching of substrate
Etching inorganic substrate
C216S098000, C216S104000, C438S753000
Reexamination Certificate
active
07824564
ABSTRACT:
A method for flattening a glass substrate includes the steps of preparing plural kinds of etching liquids different from one another in an etching rate, preparing the glass substrate, and etching the glass substrate at least one time with each of the etching liquids and executing the etching a plurality of times in total. When the etchings are executed the plurality of times, an etching rate of the glass substrate with one etching liquid used for one etching of plural etchings is slower than that of the glass substrate with the another etching liquid used for another etching executed after the one etching process of the plural etching processes.
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Japanese Office Action dated Jan. 5, 2009 and English translation thereof issued in a counterpart Japanese Application No. 2006-165580.
Taiwanese Office Action dated Jun. 8, 2010 and English translation thereof, issued in counterpart Taiwanese Application No. 095136865.
Casio Computer Co. Ltd.
Holtz Holtz Goodman & Chick PC
Nagase & Co. Ltd.
Sanwa Frost Industries Co., Ltd.
Vinh Lan
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