Method for fixing semiconductor bodies on a substrate using wire

Details Method for fixing semiconductor bodies on a substrate using wire Method for fixing semiconductor bodies on a substrate using wire

1993-01-13

1994-05-10

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437218, 437221, 257783, 361808, 361809, 361825, H01L 2158, H01L 2168

Patent

active

053107012

ABSTRACT:
A method for mounting semiconductor bodies on a substrate includes bonding ires to a substrate being formed of metal at least in given locations. Semiconductor bodies are laterally fixed to the given locations of the substrate with the wires. The semiconductor bodies are subsequently materially joined to the substrate in the given locations.

REFERENCES:
patent: 3370203 (1968-02-01), Kravitz et al.
patent: 3715633 (1973-02-01), Nier
patent: 3962669 (1976-06-01), Entine et al.
patent: 4661835 (1987-04-01), Gademann et al.
patent: 4949148 (1990-08-01), Battelink

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