Metal fusion bonding – With control means responsive to sensed condition
Reexamination Certificate
2003-11-28
2008-08-19
Lorengo, Jerry (Department: 1793)
Metal fusion bonding
With control means responsive to sensed condition
C228S101000, C228S103000, C228S212000
Reexamination Certificate
active
07413106
ABSTRACT:
The invention relates to a method, a device and a system for fixing a miniaturized component—especially carrying or containing at least one optical element—to a carrier plate in a highly-precise manner, by means of a soldered joint, a welded joint or an adhesive joint. Said component is positioned above the carrier plate in a relation to outer reference points by means of a gripper pertaining to a robot station. A joint is then created between the component and the carrier plate, the joint seam hardening under contraction between the component and the carrier plate, thus exerting a vertical tractive force on the gripper holding the component. At the same time as the contraction, the gripper is vertically displaced towards the carrier plate in a controlled or regulated manner, optionally up to a defined nominal position, and actively yields to the contraction such that the creation of high tensions is largely avoided and the position does not change when the component is detached from the gripper. The invention also relates to a gripper for using in said method.
REFERENCES:
patent: 5081336 (1992-01-01), Schuster et al.
patent: 6554244 (2003-04-01), Remy De Graffenried et al.
patent: 6616031 (2003-09-01), Wong et al.
patent: 7303111 (2007-12-01), Gaunekar et al.
patent: 2001/0046723 (2001-11-01), Hudson et al.
patent: 2002/0121789 (2002-09-01), Duebel et al.
patent: 35 31 715 (1987-03-01), None
patent: WO 99/26754 (1999-06-01), None
patent: WO 00/28376 (2000-05-01), None
Alain Wuersch et al. “An Innovative Micro Optical Element Assembly Robot Characterized by High Accuracy and Flexibility”, IEEE, Electronic Components and Technology Conference, 2000 pp. 218-222.
Clavel Reymond
Rossopoulos Stephane
Verettas Irène
Wuersch Alain
Barry Erin P
Leica Geosystems AG
Lorengo Jerry
Oliff & Berridg,e PLC
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