Metal working – Method of mechanical manufacture – Electrical device making
Patent
1998-05-13
2000-08-08
Picard, Leo P.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 29846, 174263, 174264, 257738, 216 18, H05K 340
Patent
active
060982837
ABSTRACT:
A via for an electronic assembly. The assembly includes a substrate which has a via hole. The via hole is filled with a conductive material that extends across a diameter of the hole. The via hole can be filled by reflowing a solder ball that is attached to an outer surface of the substrate. The substrate may be part of a multi-layered integrated circuit package, wherein the vias couples internal routing layers with external contacts of the package. The filled vias can withstand extended thermal life cycles of the package.
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Craft Leo
Goetsch Mike
Siettmann Jim
Swanger Eric
Intel Corporation
Picard Leo P.
Vigushin John B.
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