Method for filling vias in ceramic substrates with composite met

Details Method for filling vias in ceramic substrates with composite met Method for filling vias in ceramic substrates with composite met

1994-07-28

1998-01-13

Fiorilla, Christopher A.

Plastic and nonmetallic article shaping or treating: processes

Forming electrical articles by shaping electroconductive...

264259, C04B 3500

Patent

active

057075751

ABSTRACT:
A method and apparati for improved filling of via holes wherein compressive force is used to columnate conductive material due to a pseudoplastic thixotropic rheology of the material. Columnating of the material provides for easier and more accurate filling of via holes. Both automated roller apparati and manual methods are provided. The method further includes methods and apparati of removing excess conductive material from substrates after filling the via holes.

REFERENCES:
patent: 3948706 (1976-04-01), Schmeckenbecher
patent: 5490965 (1996-02-01), Christiansen

Affiliated with

Also associated with

Rating

Method for filling vias in ceramic substrates with composite met does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for filling vias in ceramic substrates with composite met, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for filling vias in ceramic substrates with composite met will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-323818