Method for filling via with metal

Semiconductor device manufacturing: process – Making passive device – Resistor

Reexamination Certificate

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C438S243000, C438S386000, C438S387000, C438S698000, C438S699000, C438S508000, C257S903000, C257S904000, C257S905000, C257S906000

Reexamination Certificate

active

07022579

ABSTRACT:
A method of filling vias for a PCRAM cell with a metal is described. A PCRAM intermediate structure including a substrate, a first conductor, and an insulator through which a via extends has a metallic material formed within the via and on a surface of the insulator. The metallic material may be deposited on the surface and within the via. A hard mask of a flowable oxide is deposited over the metallic material in the via to protect the metallic material in the via. A subsequent dry sputter etch removes the metallic material from the surface of the insulator and a portion of the hard mask. After complete removal of the hard mask, a glass material is recessed over the metallic material in the via. Then, a layer of a metal-containing material is formed over the glass material. Finally, a second conductor is formed on the surface of the insulator.

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