Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Repairing
Reexamination Certificate
2003-12-01
2009-06-09
Ryan, Patrick (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Repairing
C205S089000, C205S103000, C205S104000, C205S148000, C205S170000
Reexamination Certificate
active
07544282
ABSTRACT:
Disclosed are a method and a device for filling material separations on the surface. In methods known in prior art, which are used for filling material separations, the substrate is often influenced in a negative manner by high processing temperatures and dissimilar additives. The inventive method overcomes said disadvantage, taking place at low temperatures and allowing the material separation to be completely filled without using dissimilar substances.
REFERENCES:
patent: 4436591 (1984-03-01), de Hek
patent: 4895625 (1990-01-01), Thoma et al.
patent: 5158653 (1992-10-01), Lashmore et al.
patent: 5660705 (1997-08-01), Michaut
patent: 6024861 (2000-02-01), Takeuchi et al.
patent: 6072313 (2000-06-01), Li et al.
patent: 7008522 (2006-03-01), Boucard et al.
patent: 3627779 (1988-02-01), None
patent: 41 11 174 (1992-10-01), None
patent: 195 48 198 (1997-07-01), None
patent: 0 622 810 (1994-11-01), None
patent: 1 241 473 (2002-09-01), None
patent: 1521130 (1978-08-01), None
patent: 2170997 (1990-07-01), None
patent: 2197393 (1990-08-01), None
patent: WO 03/006710 (2003-01-01), None
De Vogelaere Marc
Körtvelyessy Daniel
Krüger Ursus
Reiche Ralph
Leader William T
Ryan Patrick
Siemens Aktiengesellschaft
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