Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2005-03-09
2008-11-04
Lindsay, Jr., Walter L (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S752000, C257S753000, C257SE21583, C257SE21586
Reexamination Certificate
active
07446415
ABSTRACT:
Methods of electroless filling electrically different features such as contact openings to form interconnects and conductive contacts, and semiconductor devices, dies, and systems that incorporate the interconnects and contacts are disclosed. The contact openings are electrically shorted together with a selective material, a nucleation layer is selectively deposited onto the area to be plated (e.g., the base of the opening), and a conductive material is electroless plated onto the nucleation layer to fill the opening. The process achieves substantially simultaneous filling of openings having different surface potentials at an about even rate.
REFERENCES:
patent: 5420074 (1995-05-01), Ohshima
patent: 5750012 (1998-05-01), Ireland et al.
patent: 5869392 (1999-02-01), Kimura
patent: 6242808 (2001-06-01), Shimizu et al.
patent: 6245656 (2001-06-01), Chen et al.
patent: 6518198 (2003-02-01), Klein
patent: 6589414 (2003-07-01), Klein
patent: 6610596 (2003-08-01), Lee et al.
patent: 6693366 (2004-02-01), Klein
patent: 6715663 (2004-04-01), Seshan et al.
patent: 6723219 (2004-04-01), Collins
patent: 6774049 (2004-08-01), Klein
patent: 6821879 (2004-11-01), Wong
patent: 6838370 (2005-01-01), Niuya et al.
patent: 6872659 (2005-03-01), Sinha
patent: 6900128 (2005-05-01), Sinha
patent: 7005379 (2006-02-01), Sinha et al.
patent: 2001/0013473 (2001-08-01), Taylor
patent: 2003/0034251 (2003-02-01), Chikarmane et al.
patent: 2003/0052330 (2003-03-01), Klein
patent: 2003/0201538 (2003-10-01), Lee et al.
patent: 2004/0011653 (2004-01-01), Collins
patent: 2004/0033687 (2004-02-01), Sinha
patent: 2004/0038052 (2004-02-01), Collins
patent: 2004/0137161 (2004-07-01), Segawa et al.
patent: 2006/0003583 (2006-01-01), Sinha et al.
Collins Dale W
Klein Rita J
Lindsay, Jr. Walter L
Micro)n Technology, Inc.
Whyte Hirschboeck Dudek SC
LandOfFree
Method for filling electrically different features does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for filling electrically different features, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for filling electrically different features will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4022234