Method for filling a trench in an integrated circuit structure w

Details Method for filling a trench in an integrated circuit structure w Method for filling a trench in an integrated circuit structure w

1985-07-25

1987-12-22

Bashore, S. Leon

Fishing, trapping, and vermin destroying

156651, 437233, B23P 1500, B44C 122, B05D 512

Patent

active

047145200

ABSTRACT:
A process is disclosed for filling a trench in an integrated circuit structure without forming a void in the trench which, in a preferred embodiment, comprises partially filling the trench with an etchable material, etching the material in the trench with an etchant capable of removing material adjacent the top of the trench at a rate faster than the rate of removal adjacent the bottom of the trench, and then filling the remainder of the trench with the material; whereby the material deposited adjacent the top of the trench will not close off the trench prior to complete filling of the bottom of the trench with the material.

REFERENCES:
patent: 4104086 (1978-08-01), Bondur et al.
patent: 4472240 (1984-09-01), Kameyama
patent: 4481070 (1984-11-01), Thomas et al.
patent: 4526631 (1985-07-01), Silvestri et al.
patent: 4528047 (1985-07-01), Bexer et al.
patent: 4533430 (1985-08-01), Bower
patent: 4544576 (1985-10-01), Chu et al.
patent: 4554728 (1985-11-01), Shepard
patent: 4626317 (1986-12-01), Bonn

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