Metal working – Method of mechanical manufacture – Electrical device making
Patent
1987-12-11
1989-08-15
Goldberg, Howard N.
Metal working
Method of mechanical manufacture
Electrical device making
228248, H05K 1304
Patent
active
048561851
ABSTRACT:
For fastening electronic components to substrates, a connecting layer having good adhesion and good electrical and thermal conductivity is manufactured by sintering from a metal powder layer. A paste formed of metal powder, such as a silver powder, and of a solvent, is processed into a solvent-free presintered film in a separate process. This film is punched in accordance with a cross-section of the component and is provided for fastening the component. In manufacturing the film, a specific solvent is employed, together with heating up rates of 5.degree. to 30.degree. C./Min and holding times of 0.5 to 5 minutes at a maximum temperature of 300.degree. C. The fastening is carried out at temperature of at least 150.degree. C. and at a minimum mechanical pressure of 30 N/cm.sup.2. The use of a film speeds up the method and enables of sintering at low temperatures and, at the same time, at low mechanical pressure.
REFERENCES:
patent: 4342606 (1982-08-01), Notton
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4746055 (1988-05-01), Ingram et al.
patent: 4810672 (1989-05-01), Schwartzbauer
Baumgartner Werner
Fellinger Johannes
Goldberg Howard N.
Ross Taylor J.
Siemens Aktiengesellschaft
LandOfFree
Method for fastening electronic components to a substrate using does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fastening electronic components to a substrate using , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fastening electronic components to a substrate using will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-112930