Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-12-12
2000-08-15
Young, Lee
Metal working
Method of mechanical manufacture
Electrical device making
29846, H05K 302
Patent
active
061017108
ABSTRACT:
An anticipation of engineering changes to a multiple-level integrated circuit package, resulting in a significant decrease in the turnaround time required to make engineering changes. After the first pass of the design phase is complete and before manufacture has begun, surplus I/O at different package levels are wired into surplus connections involving all but the highest package level. These surplus connections are reserved for future use when engineering changes become necessary. Once manufacture is complete, the surplus connections can be converted into logical connections by ECing only the highest packaging level with the quickest turnaround time. The surplus connections also provide a means for implementing ongoing incremental engineering changes as they are needed.
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Hackett Michael Lee
Schell Timothy Allen
Selinger Craig Richard
Anderson Jay H.
Chang Rick Kiltae
International Business Machines - Corporation
Jones II Graham S.
Mortinger Alison D.
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