Method for facilitating attachment of wires to a motherboard

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

29509, 29505, 156 732, H01R 4304

Patent

active

041909518

ABSTRACT:
A switch assembly comprises a deformable electrically insulative substrate with a plurality of grooves formed therein extending in a direction parallel to a given axis. Electrically conductive wires are disposed in the grooves and extend beyond one end of the substrate. The grooves have a width and a depth such that the wires are accurately positioned in the substrate and securely held therein. Flexible, electrically conductive strips having a column of dome shaped portions or discs overlie the wires, each dome being formed with a centrally located projection which moves into engagement with a wire when the dome is depressed. Materials for the electrically conductive members are so chosen as to minimize corrosion problems. In the preferred embodiment, the strips are formed of a high strength brass, bus wires are of nickel containing bronze and contact wires are of nickel containing brass. A layer of electrically insulative, flexible material overlies the substrate and strips and is sealingly attached to the exposed top surface of the strips and substrate. The wires are attached to a transversely extending bar intermediate the substrate and the free end of the wires to facilitate connection to a motherboard.

REFERENCES:
patent: 3831063 (1974-08-01), Keough
patent: 3916516 (1975-11-01), Harms et al.
patent: 4005293 (1977-01-01), Boulanger

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