Method for fabrication of a semiconductor device

Details Method for fabrication of a semiconductor device Method for fabrication of a semiconductor device

2003-09-19

2011-10-11

Nguyen, Khiem D (Department: 2823)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

C438S029000, C438S122000, C257SE33001, C257SE33075

Reexamination Certificate

active

08034643

ABSTRACT:
A method for fabrication of a semiconductor device on a substrate, the semiconductor having a wafer. The method includes the steps:(a) applying a seed layer of a thermally conductive metal to the wafer;(b) electroplating a relatively thick layer of the conductive metal on the seed layer, and(c) removing the substrate. A corresponding semiconductor device is also disclosed.

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