Method for fabricating vertical CMOS image sensor

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation

Reexamination Certificate

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C438S268000, C438S521000, C257SE21610, C257SE21643

Reexamination Certificate

active

07732246

ABSTRACT:
A method of fabricating a vertical CMOS image sensor is disclosed, to improve the integration with the decrease in size of pixel by minimizing the lateral diffusion, in which phosphorous and arsenic ions are implanted while controlling the dose and energy, the method including forming a first photodiode in a semiconductor substrate; forming a first epitaxial layer on the semiconductor substrate; forming a first plug by sequentially implanting first and second ions in the first epitaxial layer; forming a second photodiode in the first epitaxial layer; forming a second epitaxial layer in the first epitaxial layer; forming an isolation area in the second epitaxial layer; and forming a third photodiode and a second plug in the second epitaxial layer.

REFERENCES:
patent: 4239554 (1980-12-01), Yamazaki
patent: 4722910 (1988-02-01), Yasaitis
patent: 5162887 (1992-11-01), Dierschke
patent: 5494857 (1996-02-01), Cooperman et al.
patent: 6055460 (2000-04-01), Shopbell
patent: 6110788 (2000-08-01), Violette et al.
patent: 6128091 (2000-10-01), Uchida et al.
patent: 6187684 (2001-02-01), Farber
patent: 6194770 (2001-02-01), Zarnowski et al.
patent: 6379992 (2002-04-01), Jo
patent: 6414343 (2002-07-01), Kondo et al.
patent: 6580109 (2003-06-01), Thomas et al.
patent: 6646318 (2003-11-01), Hopper et al.
patent: 6746933 (2004-06-01), Beintner et al.
patent: 6875558 (2005-04-01), Gaillard et al.
patent: 6949424 (2005-09-01), Springer
patent: 7132724 (2006-11-01), Merrill
patent: 7279353 (2007-10-01), Rhodes
patent: 7419844 (2008-09-01), Lee et al.
patent: 7423307 (2008-09-01), Lee
patent: 2002/0058353 (2002-05-01), Merrill
patent: 2006/0056034 (2006-03-01), Tsuruma
patent: 2006/0073623 (2006-04-01), Conley, Jr. et al.
patent: 2006/0086957 (2006-04-01), Kang
patent: 2006/0138494 (2006-06-01), Lee
patent: 2006/0145224 (2006-07-01), Lee
patent: 2008/0142857 (2008-06-01), Park
patent: 2008/0303073 (2008-12-01), Lee
patent: 6-132505 (1994-05-01), None
patent: 8-148665 (1996-06-01), None
patent: 9-222505 (1997-08-01), None
patent: 2001-068658 (2001-03-01), None
patent: 2004-172335 (2004-06-01), None
patent: 2004-356270 (2004-12-01), None
patent: 0165376 (1998-09-01), None
Sang Slk Kim, Seong Gyun Kim, and No Seok Yang; CCD Image Sensor and Method for Manufacturing the Same: Korean Patent Abstracts; Publication Date: Sep. 16, 1998; 2 Pages: Publication No. 100165376 B1; Korean Intellectual Property Office, Republic of Korea.
Stanley Wolf Ph.D.; Chapter 2, Isolation Technologies for Integrated Circuits; Silicon Processing for the VLSI ERA, vol. 2: Process Integration; Copyright 1990; Lattice Press, Sunset Beach, CA.
Tomohiko Otani; “Device Having Microlens and Shape of Microlens”; Patent Abstracts of Japan; Publication No. 09-222505; Publication Date: Aug. 26, 1997; Japanese Patent Office; Japan.
Takashi Nakano and Shinichi Teranishi; “Solid Image Pickup Element”; Patent Abstracts of Japan; Publication No. 08-148665; Publication Date: Jun. 7, 1996; Japanese Patent Office; Japan.
Koichi Harada, Yasuhiro Ueda, Nobuhiko Umetsu, Kazuji Wada, Yoshitetsu Toumiya and Takeshi Matsuda; “Solid State Image Sensor and Fabrication Thereof”; Publication No. JP2001068658A; Publication Date: Mar. 16, 2001; Japanese Patent Office; Japan.
Koichiro Okumura and Sakae Hashimoto; “Optoelectric Transducer and Its Manufacturing Method”; Patent Abstracts of Japan; Publication No. 2004-356270; Publication Date: Dec. 16, 2004; Japan Patent Office, Japan.
Tadakuni Narabe; “Solid-State Imaging Apparatus”; Patent Abstracts of Japan; Publication No. 2004-172335; Publication Date: Jun. 17, 2004; Japan Patent Office, Japan.
Masanori Ohashi; “Solid-State Image Sensing Element and Manufacture Thereof”; Patent Abstracts of Japan; Publication No. 06-132505; Publication Date: May 13, 1994; Japan Patent Office, Japan.

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